FAILURE
ANALYSIS
Failure analysis is the process of collecting and
analyzing data to determine the cause of a failure. It is an important discipline in many branches of
manufacturing industry, such as the electronics industry, where it is a vital
tool used in the development of new products and for the improvement of
existing products. The failure analysis process relies on collecting failed
components for subsequent examination of the cause or causes of failure using a
wide array of methods, especially microscopy and spectroscopy.
Failure analysis engineers
A failure analysis
engineer often plays a lead role in the analysis of failures, whether a
component or product fails in service or if failure occurs in manufacturing or
during production processing. In any case, one must determine the cause of
failure to prevent future occurrence, and/or to improve the performance of the
device, component or structure.
TECHNIQUES OF FAILURE ANALYSIS
This is a focused approach designed to include one or more
specific analysis techniques to understand, characterize or determine a defined
task/need.
level 1
The scope of the analysis includes failure verification,
non-destructive examination of product, sub-system, or component and internal
visual examination.
level 2
This stage of the investigation uses fault isolation
techniques to localize the failure to a specific site on a sample, providing
valuable information pointing to a design, product, or package issue.
level 3
The scope of this effort incorporates designing and
applying the appropriate FA methodology to physically identify and characterize
the failure mechanism and ultimately determine root cause.
level 4
The stage of failure analysis which digs deeper into the
use of specialized techniques and tools for a full causal analysis. Examples
include circuit modification followed by retest, Laser timing probe,
nanoprobing, materials characterization, contamination and its definitive role
in the failure.
Research by : Hairi
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