The assembly process is necessary to protect the chip,
facilitate its integration into electronic systems, limit electrical
interference and enable the dissipation of heat from the device. Once the
front-end production process is complete, the wafer is transferred to an
assembly facility, where it is sawed into individual semiconductor chips.
These semiconductor chips are then individually attached by
means of an alloy or an adhesive to a lead frame, a metallic device used to
connect the semiconductor to a circuit board. Leads on the lead frame are then
connected by aluminum or gold wires to the input/output terminals on the
semiconductor chip through the use of automated machines known as wire bonders.
Each semiconductor device is then encapsulated in a plastic molding compound or
ceramic case, forming the package.
After assembly, power semiconductors are tested for
different operating specifications, including functionality, voltage, current
and timing. The completed packages are then shipped to the customer or to their
final end-user destination through drop shipment.
Research by: Amir
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